PowerTester & T3ster - power cycling and transient thermal analysis

 

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Electronics IC package thermal modeling

Using the Simcenter T3STER to develop high thermal conductivity sintered silver paste

Power cyclings effect on IGBT longevity

Three thermal simulation and test innovations for electronics equipment design

Field Lifetime Estimation of Power Modules using Active Power Cycling

Cracking explained – Quantification of cracked areas in the thermal path of high-power multi-chip modules

Reliability Evaluation of Sintered Copper Die Bonding Materials

Evaluating delamination of power modules using Simcenter T3STER – Yamaha case study

POWERTESTER Datasheet

Power cycling and thermal reliability of automotive IGBTs